JPS598129U - 端子盤の温度補償素子 - Google Patents

端子盤の温度補償素子

Info

Publication number
JPS598129U
JPS598129U JP10183882U JP10183882U JPS598129U JP S598129 U JPS598129 U JP S598129U JP 10183882 U JP10183882 U JP 10183882U JP 10183882 U JP10183882 U JP 10183882U JP S598129 U JPS598129 U JP S598129U
Authority
JP
Japan
Prior art keywords
terminal board
electrode plate
temperature compensation
compensation element
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10183882U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0116024Y2 (en]
Inventor
荒川　知治
上杉　利明
「そ」根　茂夫
Original Assignee
株式会社チノ−
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社チノ− filed Critical 株式会社チノ−
Priority to JP10183882U priority Critical patent/JPS598129U/ja
Publication of JPS598129U publication Critical patent/JPS598129U/ja
Application granted granted Critical
Publication of JPH0116024Y2 publication Critical patent/JPH0116024Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP10183882U 1982-07-07 1982-07-07 端子盤の温度補償素子 Granted JPS598129U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10183882U JPS598129U (ja) 1982-07-07 1982-07-07 端子盤の温度補償素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10183882U JPS598129U (ja) 1982-07-07 1982-07-07 端子盤の温度補償素子

Publications (2)

Publication Number Publication Date
JPS598129U true JPS598129U (ja) 1984-01-19
JPH0116024Y2 JPH0116024Y2 (en]) 1989-05-12

Family

ID=30240311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10183882U Granted JPS598129U (ja) 1982-07-07 1982-07-07 端子盤の温度補償素子

Country Status (1)

Country Link
JP (1) JPS598129U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS648160U (en]) * 1987-07-02 1989-01-18

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5617531U (en]) * 1979-07-18 1981-02-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5617531U (en]) * 1979-07-18 1981-02-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS648160U (en]) * 1987-07-02 1989-01-18

Also Published As

Publication number Publication date
JPH0116024Y2 (en]) 1989-05-12

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